Illustration by Alex Castro / The Verge
Intel’s chipmaking business may have run into a bit of a snag, as recent tests using the company’s next-gen manufacturing process have failed, according to Reuters.
To carry out the tests, Intel reportedly sent Broadcom’s silicon wafers — or the components used as a semiconductor’s base — through its more efficient 18A manufacturing process. After examining the results, Broadcom found that the process isn’t ready for high-volume production, Reuters reports.
The 18A process is a Read Entire Article
