Dbrand just sued a rival casemaker for copying its “Teardown” skins that let you see under the back cover of your phone, laptop, or handheld gaming machine.
It’s also — purely coincidentally, I’m sure! — announcing a brand-new set of skins that take the idea even farther. No, I don’t mean “further”; I’m talking about going literally millimeters deeper into a device’s components with a 450-kilovolt X-ray, showing details you can’t get just by photographing a gadget w...